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CONTENTS
July • August 2020 DEPARTMENTS
Volume 24, Number 4
5 An introduction to chiplet-based
architectures
By John Park
[Cadence]
33 International Directory of Bonding
Equipment for 2.5D and 3D Assembly
[Chip Scale Review]
The 5G rollout is underway, exponentially 48 Industry News
spurred on by COVID-19 and the new [Chip Scale Review]
data requirements for video conferencing,
meetings, and virtual conferences, as millions
of people around the world work from home.
The reality of both increased demand for
faster connections and higher bandwidth to FEATURE ARTICLES
handle the larger volumes of data passing
through networks must be met with attractive
solutions. RF GaN power amplifiers enable 10 Electronic packaging for future electronic
faster speeds, lower latency, and mission- systems
critical applications. A low-void die attach By Michael Töpper, Tanja Braun
process of 1% or less for GaN dies plays a
crucial role in achieving these benefits. [Fraunhofer IZM]
Photo courtesy of Palomar Technologies
Chip Scale Review July • August • 2020 [ChipScaleReview.com] 1 1
