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the die cut out the sinter film to the exact References
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Biographies
Jonathan Abdilla is Product Manager at BESI Austria (Radfeld). He holds a degree in Mechanical
Engineering, and a Masters in business and administration. Prior to this position, he was Manager for
Process Development responsible for overseeing epoxy die attach, flip chip, TCB, hybrid bonding and
sintering, among other areas. He has 14 years of packaging experience in the semiconductor industry, is
active in the SEMI association as a member of a technical committee, and is currently involved in several
EU-funded projects. Email jonathan.abdilla@besi.com
Maurizio Fenech is Global Applications Manager at MacDermid Alpha Assembly Solutions,
Langenfeld, Germany. He is a thermodynamics engineering major and holds a PhD in laser additive manufacturing.
After working as a laboratory manager in a surface engineering and characterization facility, he held a position as
director for research facilities at the U. of Malta, where he is currently a tenured academic.

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