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Figure 4: Qualcomm module: front, rear and opened views. SOURCES: [5,6]
method also allows an increase in the several antennas (patch and dipole) are expecting to see this year is the use of DELIVERS INDUSTRY LEADING PERFORMANCE
density of the internal structure because with integrated transceiver, and a power fan-out processing in antenna-in-package
the sensitive devices are outside. Finally, management integrated circuit (PMIC) [5]. technology, especially in the 5G mmWave
it results in a reduction of the cost of The next-generation of 5G mmWave implementation for high-end phones.
the package giving a share of less than AiPs will have the same architecture but
40% in the cost breakdown, as shown with several differences in the transceiver, Acknowledgment
in Figure 3. To support the structure as well as in the PCB substrate, to be This article has been written in
and offer enough space to integrate the more efficient. Upcoming 5G technology collaboration with Cédric Malaquin,
flip-chip (FC) die at the bottom of the will also be implemented at the Sub-6 Technology & Market Analyst, RF
package, the use of a ball grid array is a level where more band integration will be Devices & Tech nologies at Yole Kulicke & So a’s Katalyst™ delivers the
requirement. The same structure cannot required at the component level to retain Développement (Yole).
be achieved with LGA. the small form factor, but with more
connectivity. Indeed, the tendency today References industry leading performance in accuracy and
Packaging technologies: what’s the is to integrate an ultra-high band front 1. “5G’s Impact on RF Front-End Module
next step? end structure in a 2G power amplifier and Connectivity for Cell phones speed for flip-chip placement. Its hardware and
In RF applications, handling the module, where neither can be affected by 2019,” Yole Développement, 2019.
radiation and thermal management the radiation of the other. 2. “RF Modules & Components Review technology enable < 3 μm accuracy on
are among the main concerns. So, the in Smartphones,” System Plus
packaging is an important part of the Summary Consulting, 2017.
development of the technologies. The latest Low-frequency technologies are the 3. “SKYWORKS SKY78191 Teardown substrate or wafer, o ering lower
example is with 5G mmWave, where very most advanced in terms of SiP. Today, Analysis,” System Plus Consulting, 2019.
high-frequency communication requires a new processors are demonstrating 3D 4. “Broadcom AFEM-8100 Mid & Cost-of-Ownership in the industry.
new type of packaging, such as antenna- integration with a package-on-package High Band Front-End Module:
in-package (AiP). To be implemented in configuration along with an embedded Physical & Cost Analysis,” System
a smartphone, companies have developed interconnection bridge in a PCB substrate. Plus Consulting, 2020.
several alternatives in terms of size, power Another trend is to use die chiplets to 5. “Qualcomm 5G mmWave Front-End
consumption, and radiation power. Also, as create an ecosystem on a transposer with Module Chipset: Physical & Cost
the wavelength is in the millimeter range, different functionality. These two trends Analysis,” System Plus Consulting, 2019.
the radiating element must be as close as could be applied to the RF domain, 6. “Qualcomm 5G mmWave Chipset
possible to the front end. So, as shown but will also require new isolation and 2nd Generation: Physical & Cost
in Figure 4, the smallest 5G AiP in the thermal dissipation techniques. One analysis,” System Plus Consulting,
market is from Qualcomm and features interesting packaging technology that we 2020.

Biography
Stéphane Elisabeth is Expert Cost Analyst in RF, Sensors and Advanced Packaging at System Plus
Consulting, Nantes, France. He joined the company in 2016 and has a deep knowledge of materials
characterizations and electronics systems. He holds an Engineering Degree in Electronics and Numerical
Technology from Polytech Nantes, and a PhD in Materials for Microelectronics from the U. of Nantes.
Email: selisabeth@systemplus.fr

18 Chip Scale Review July • August • 2020 [ChipScaleReview.com]
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