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Advanced RF packaging technology trends,

from GSM to 5G

By Stéphane Elisabeth [System Plus Consulting]
T he consumer market today is increase in growth of 5G technology that integrate several functionalities

one of the most innovative
mainly be led by Sub-6 technology with
on the technology itself to implement
sectors in the indust r y. from 2019 onward. The growth will in a small area. The second is to rely
Indeed, in 2019, 5G mobile phone the introduction of a new frequency the new standard. Finally, the third
shipments have started and should band or by the reuse of 4G frequency approach is to develop new packaging
represent ~30% of the market by the end bands. The “core” market, 2G and technology allowing the implementation
of 2025 [1]. In this regard, connectivity 3G, is expected to continue the use of the front end close to the antennas.
has a very high value in the design of of traditional packaging, namely, Usually, innovation in packaging comes
the phone. Several standards have been land grid array (LGA). 4G and 5G after innovation in the implemented
integrated into smartphones over the technologies are expected to require technology, but the opposite could well
years, from Global System for Mobile new developments in order to enable be seen today.
Communications (GSM) to the more adequate integration in the smartphone.
recent 4G Long Term Evolution (LTE) This is currently opening the market to Packaging technologies: standard
Advanced. These standards bring more advanced packaging technology relying to advanced
challenges to smartphone designers on system-in-package (SiP). Included with the several technologies
who have to integrate the related B e sid e s t h e a i r s t a n d a r d , t h e that are under development to filter
components. Thanks to advanced integration technology will also split the or amplify the signal, traditional
packaging technology, these challenges supplier market. As shown in Figure 1, packaging, such as LGA, is widely
have been overcome, providing the in 2018 the total market reached $15 a d o p t e d t o i m p l e m e n t t h e n e w
latest communication experience to the Billion with more than 25% held by components. But in order to improve the
world. In this article, we will review the Murata. The company is currently form factor along with the performance
technology drivers and the state of the leader of the market thanks to its largest of t h e d e v i c e s , n e w p a c k a g i ng
market, as well as the latest advances portfolio (modules and discretes). To technology, such as double-side ball
in terms of radio frequency (RF) maintain their position, the rest of grid array (BGA), has been developed.
packaging. the leading companies are putting all In this way, the packaging has enabled
In the smartphone market, several RF their cards on 5G development and 4G the implementation of the multimode
suppliers share the total revenue. The integration. This will come through multiband power amplifier module as
evolution of the market, as estimated three main approaches. The first is well as enabled the innovation of the
by Yole Développement, shows an the development of new components implemented technology.

Figure 1: Mobile shipment forecast by air standard: overall market share in 2018. SOURCE: [1]

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