Page 54 - Chip Scale Review_January-February_2024-digital
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350+ TECHNICAL PAPERS HIGHLIGHTS
COVERING: n 41 technical sessions with a
Advanced Packaging Design, total number of 350+ technical
Processes, Reliability, Modelling papers including:
Hybrid Bonding & Advanced • 5 interactive sessions
Interconnect including one student
session
Fan-Out Wafer Level & Panel Level
May 28 - May 31, 2024 Optics and Photonics Packaging n 9 special invited sessions
Additive Manufacturing
n 16 CEU-approved Professional
Quantum and AI Systems Development Courses
Gaylord Rockies Resort High-Density 3D & Substrates n Multiple opportunities for
networking
Heterogeneous Integration
& Convention Center Chiplets n Technology Corner Exhibits,
showcasing industry-leading
Denver, Colorado, USA High-Power & Thermal product and service companies
Management
from around the world
Flip Chip, Die Bond, Chip Scale n Various sponsorship
Flexible & Wearable
Don’t Miss Out on the RF Components, Antennas opportunities for your
company’s visibility
Industry’s Premier Event! Harsh Environment Reliability and n ECTC Gala and evening
Automotive receptions
The only event that encompasses
the diverse world of integrated
systems packaging.
For more information, visit:
www.ectc.net
Conference Sponsors: Official Media Sponsor:
ADVERTISER INDEX
A m kor Tec hnolog y ................................................. 6
Br ewer S cience ..................................................... 29
C y ber O p tic s ........................................................ OBC
DL Technology ......................................................... 45
E - t ec I n t er c on n ec t ............................................... 47
EC T C .................................................................. 52
EV Group ..................................................................... 2
IMAPS ................................................................. IBC
In t e k plu s C o., L t d ................................................ 21
I r o n w o od E l e c t r o n i c s ..................................... 3 5
ISC Co., Ltd. ........................................................... 23
K u l i c k e & S o f f a ..................................................... 12
Leeno Industrial ............................................... IFC, 24
M i c r o C i r c u i t L a b o r a t o r i e s ..................................... 11
On t o I n n ov a t i o n .................................................. 49
Plasma Etch ........................................................... 52
Siem en s E D A ..................................................... 9
S oni x ..................................................................... 41
Technic ................................................................... 36
TestConX ............................................................... 50
Test Tooling Solutions Group ................................... 32
T SE Co. Ltd ........................................................... 4,5
WinWay Technology ................................................. 27
January February 2024
For Advertising Inquiries: ads@chipscalereview.com
52 Chip Scale Review January • February • 2024 [ChipScaleReview.com]
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