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MARKET TRENDS

Advanced packaging: Fueling the next era of

semiconductor innovation

By Bilal Mohammed Hachemi, Emilie Jolivet [Yole Intelligence]

T oday, the semiconductor methods, with different I/O density and applications require high-performance

A I and machi ne learning. A I
I/O pitch depending on the targeted
industry is at the forefront
of technological innovation,
revolutionizing var ious application’s requirements, performance, computing with low latency. AP platforms
and cost (Figure 1). In our recent report
like 2.5D/3D stacked packaging, HBM,
applications such as artificial intelligence [1] we consider the following as AP and Si interposers allow for higher
(AI), 5G communications, and high- platforms: fan-out (FO) packaging, memory bandwidth and improved system
performance computing (HPC). As wafer-level chip-scale packaging integration, critical for AI inference and
we venture into the generative AI era, (WLCSP), f lip-chip ball-grid array training tasks.
there is an ever-growing demand for (fcBGA), flip-chip CSP (fcCSP), system- Generative AI era. The generative AI
more powerful, compact, and efficient in-package (SiP), and 2.5D/3D stacked era emphasizes the ability of AI models
electronic devices. In this pursuit, packaging, including complementary to create new data, content, or solutions
advanced packaging has emerged as metal-oxide semiconductor (CMOS) autonomously. This era demands highly
a crucial enabler, pivotal in the More- image sensors (CIS) using hybrid efficient hardware capable of processing
than-Moore era. This article delves into bonding, high-bandwidth memory vast amounts of data and generating
the definition of advanced packaging (HBM), 3D-stacked dynamic random complex algorithms in real time, which is
platforms and how they shape the future access memory (DRAM) (3DS), 3D made possible by AP technologies.
of semiconductors. system-on-chip (3D-SoC), 3D NAND, Si 5G communication. The rollout
Advanced packaging (AP) refers to a interposers and embedded Si bridges. of 5G technology demands compact
diverse set of innovative technologies The significance of AP cannot be and efficient devices to accommodate
that package integrated circuits (ICs) overstated, especially in the context of complex communication systems. AP
to increase functionality, improve emerging technologies and applications. solutions like WLCSP and fan-out
performance, and provide added value The following sections present the main packaging enable smaller form factors,
compared to traditional packaging drivers fueling the need for AP. lower power consumption, and improved

Figure 1: Advanced packaging technology roadmap: I/O density vs. I/O pitch. I/O density refers to total number of I/Os per package platform area. The plot was
generated based on a Yole Group database, with reference to the industry average value. SOURCE: [1]

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