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Volume 27, Number 5
September • October 2023
The Future of Semiconductor Packaging
FEATURE ARTICLES (continued)
STAFF
Kim Newman
Publisher 25 Challenges with self-assembly applied to die-to-wafer
knewman@chipscalereview.com hybrid bonding
By Emilie Bourjot, Frank Fournel, Pierre Montméat, Loic Sanchez, Thierry Enot
Lawrence Michaels [CEA-Leti]
Managing Director/Editor
lmichaels@chipscalereview.com
37 Efficiency and cost implications of multi-die
Debra Vogler
Senior Technical Editor heterogeneous integration
dvogler@chipscalereview.com By Glenn Farris [Universal Instruments]
43 Mitigating the thermal bottleneck in advanced interconnects
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