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September • October 2023 CONTENTS
Volume 27, Number 5
DEPARTMENTS
MARKET TRENDS
7 Advanced packaging: Fueling the next era of
semiconductor innovation
By Bilal Mohammed Hachemi, Emilie Jolivet [Yole Intelligence]
33 International Directory of Bonding Equipment for 2.5D
and 3D Assembly
New semiconductor materials, alternative pad [Chip Scale Review staff]
designs, and ever-shrinking geometries are
raising the complexity and the cost of wafer
test, posing tough challenges—especially on the FEATURE ARTICLES
probing side. These trends are driving the need
for innovative test techniques able to increase Improving wafer test efficiency and minimizing
capacity and control capital equipment cost. 12
A new approach to wafer testing, based on cost per die
flying probe technology, has been introduced By Luca Fanelli [SPEA America]
in order to allow manufacturers to increase test
efficiency, thereby minimizing the cost per die. Packaging innovation drives inspection requirements for
18
Cover image courtesy of SPEA S.p.A. automotive apps and more
By Olivier Dupont [KLA Corporation]
Chip Scale Review September • October • 2023 [ChipScaleReview.com] 1 1
