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INTERNATIONAL DIRECTORY OF BONDING EQUIPMENT FOR 2.5D AND 3D ASSEMBLY

                  Directory data was compiled from company inputs and/or website search and may not be current or all-inclusive as of the date of publication
          COMPANY HEADQUARTERS              BONDING TOOLS                     WHAT ELSE THEY MAKE
          Street Address
          City, State, Zip
          Country
          Telephone
          Fax
          Website

          Protec Co. Ltd                     Eutectic Die Bonder              Flip Chip Attach
          Pnuematic Business Group           Epoxy Die Bonder                 Lid Attach System
          11-14 Simin-daero 327beon-gil      Hybrid Die Bonder
          Dongan-gu, Anyang-si
          Gyeonggi-do
          South Korea
          Tel: +82-32-822-9183
          www.protec21.co.kr/eng

          Semiconductor Equipment Corp.      Flip Chip Bonder                 Pick & Place Systems, Cleaning Systems for:
          5154 Goldman Avenue                                                 FOUPS, SMIF Pods, Cassettes,
          Moorpark, CA 93021                                                  FOSBS & EUV Pods
          USA
          Tel: +1-805-529-2293
          www.semicorp.com
          SET Corporation SA                 Flip Chip Bonders                Lid Attach System
          Smart Equipment Technology                                          Large Device Bonders
          131, Impasse Barteudet                                              Non-imprint
          74490 Saint Jeoire                                                  Nanoimprint Lithography
          France
          Tel: +33 (0) 450 35 83 92
          www.set-sas.fr/en

          Shibaura Mechatronics Corporation  Die Bonders                      FEOL products (etching, stripping, coating,
          2-5-1, Kasama, Sakae-ku, Yokohama,  Flip Chip Bonders               jetting) and BEOL
          Kanagawa Pref. 247-8610
          Japan
          Tel: +81-45-897-2421
          www.shibaura.co.jp/e

          Shibuya Corporation                High Precision Thermo Compression Flip Chip Bonders  Micro Solder Ball Mount
          Ko-58 Mameda-Honmachi,             Semi-auto Thermo Compression Flip Chip Bonders  LED Bonding
          Kanazawa, Ishikawa 920-8681                                         Photonics Bonding
          Japan                                                               Film Application
          Tel: +81 (76) 262-2201                                              Chip-on-Glass
          www.shibuya.co.jp

          Shinkawa Ltd.                      Die Bonders                      Bump Bonders
          2-51-1 Inadaira,                   Flip Chip Bonders                Wire Bonders
          Musashimurayama-shi                Thermo Compression Bonders (C2S and C2W)
          Tokyo 208-8585
          Japan
          Tel: +81-42-560-1231
          www.yamaha-robotics.com/en/products/
          manufacturer/?maker=SHINKAWA LTD.

          SUSS MicroTec SE                   Permanent Wafer Bonders          Mask Aligner
          Schleißheimer Straße 90            Temporary Wafer Bonders          Coater/Developer
          85748 Garching                     Debonders                        Inkjet Printer
          Germany                                                             Nanoimprint Equipment,
          Tel: +49 89 32007 0                                                 Photomask Cleaning Equipment
          www.suss.com

          Tresky GmbH                        Die Bonders                      Dispensing Attachments,
          Neuendorfstrasse 19 B              Flip Chip Bonders                Heating Plates
          16761 Hennigsdorf                                                   Handlers
          Germany
          Tel: +49 (0)3302 866 92-0
          www.tresky.de
        Compiled by Chip Scale Review • Submit all Directory inquires and updates to directories@chipscalereview.com

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