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INTERNATIONAL DIRECTORY OF BONDING EQUIPMENT FOR 2.5D AND 3D ASSEMBLY
Directory data was compiled from company inputs and/or website search and may not be current or all-inclusive as of the date of publication
COMPANY HEADQUARTERS BONDING TOOLS WHAT ELSE THEY MAKE
Street Address
City, State, Zip
Country
Telephone
Fax
Website
Amadyne GmbH Die Bonder, Automatic
Industrial Automation Die Bonders, Low Volume
Draisstraße 11a
D-77815 Bühl
Germany
Tel: +49 7223 2818483
www.amadyne.net
Applied Microengineering Limited Wafer Bonders
Unit 8, Library Avenue
Hartwell Campus
Didcot, Oxfordshire, OX11 0SG
United Kingdom
Tel: +44 (0)1235 833934
www.aml.co.uk
ASMPT AMICRA GmbH High Precision Die Bonders Customized Systems
Marie-Curie-Str. 6 Flip Chip Bonders High Speed Dispense Systems
D-93055 Regensburg, Germany
Phone: +49- 941-208209 0
www.amicra.semi.asmpt.com
ASMPT Hong Kong Limited Die Bonders Test & Finish Handling System
19/F, Gateway ts, 8 Cheung Fai Road, Flip Chip Bonders Encapsulation Solutions Equipment
Tsing Yi, New Territories, Hong Kong Deposition Process Equipment
Tel: +852 2619 2000 Surface Mount Technology
www.asmpt.com
Ayumi Industry Co., Ltd. Wafer Bonders Vacuum Sealing and Deposition
60 Kagumachi, Bessho-cho, Himeji-shi Bond Alignment and Annealing
Hyogo-ken 671-0225
Japan
Tel: +81-79-253-2771
www.ayumi-ind.co.jp/en
BE Semiconductor Industries N.V. (ESEC and Datacon Legacy Brands) (Meco and Fico Legacy Brands)
P.O. Box 90 Epoxy & DAF high speed die bonders Leadframe Plating Equipment
6920 AB Duiven Soft Solder & TLPB Package Saw
Ratio 6 High accuracy, high speed Flip Chip Bonders Package Trim and From
6921 RW Duiven Multi Module Attach Bonders Package Molding
The Netherlands Sinter & Eutectic bonding Wafer Molding
Tel: +31 26 319 4500 Camera and photonic assembly Chemical deflash
www.besi.com Thermo Compression Bonders Flux cleaning
(C2W and C2S)Cu-Cu Die to Wafer Hybrid bonders
Dr. Tresky AG Die Bonders (Manual)
Boehnirainstrasse 13 Die Bonders (Semi-automatic)
CH-8800 Thalwil Options: Flip-Chip, RFID, Copper Pillar,
Switzerland Thermosonic Flip-Chip
Tel: +41 (0)44 772 1941
www.tresky.com/en/index-en.php
EV Group (EVG) Wafer Bonders Lithography/Nanoimprint Lithography (NIL) Systems
Dl Erich Thallner Strasse 1 Chip-to-Wafer Bonders Photoresist Coaters
A-4782 St. Florian am Inn Temporary Bonding and Debonding Systems Cleaning Systems,
Austria Metrology and Inspection Systems
Tel: +43 7715 5311 0
www.evgroup.com/en
Fasford Technology Co., Ltd. High Accuracy Die Bonders
610-5 Shimoimasuwa
Minami Alps City, Yamanashi Pref.
Japan 400-0212
Tel: +055-284-6661
www.fasford-tech.com
Compiled by Chip Scale Review • Submit all Directory inquires and updates to directories@chipscalereview.com
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