Page 29 - Chip Scale Review_July August_2023-digital

equipment. The bonder is also being put
inside the front-end condition to ensure
cleanliness. This is a very costly operation
compared to running in a traditional back-
end assembly clean room. To ensure a
successful bond with good yield, not only
are cleaning and activation of the chiplets
and target wafer needed to be done by LEADERS IN
the material preparation tool critical,
but queue time control and cleanliness MICRO DISPENSING
are also vital. Integration of the material
preparation tool and multiple bonders TECHNOLOGY
is being advocated, which will induce a
“line balancing” issue. The situation will SMALL REPEATABLE VOLUMES
be further complicated if the number of ARE A CHALLENGE, BUT NOT
chiplet types increases. All these issues IMPOSSIBLE IF YOU HAVE BEEN
incur additional costs compared with CREATING THEM AS LONG AS WE HAVE.
other devices running in HVM mode with
TCB and mass reflow (MR) processes.
To fully bring up the merit of HB
technology for next-generation chiplets- TO DO IT WELL,
integrated HI devices in a much more WE PROVIDE THREE THINGS:
cost-effective way, and enable it for
more applications than just very high-
end devices, new development efforts are
being undertaken.
Dispensing Expertise in a variety of microelectronic
Summary packaging applications.
The rise of the HPC and AI era exerts
increasing demand for performance Feasibility Testing & Process Verification based
advancement of computational devices. on years of product engineering, material flow testing
With f ront- end node tech nolog y and software control.
continuing to evolve, advanced packaging
technology is making corresponding Product Development for patented valves,
prog ressive development s. Bot h dispensing cartridges, needles, and accessories.
advanced TCB and HB are promising
FLI processes to enable heterogeneous
integration and chiplets applications
for our industry. Reaching HVM at a
reasonable cost of ownership for advanced
packaging technology requires not only Our Micro Dispensing product line is proven and trusted by
the effort of equipment manufacturers manufacturers in semiconductor, electronics assembly, medical
to develop equipment capabilities, but device and electro-mechanical assembly the world over.
also close collaboration with the user to www.dltechnology.com.
fully understand design requirements,
associated material technology, as well as 216 River Street, Haverhill, MA 01832 • P: 978.374.6451 • F: 978.372.4889 • info@dltechnology.com
manufacturing conditions.

Biographies
Nelson Fan is the VP of Business Development in Advanced Packaging Technology (APT), SEMI Solutions
at ASMPT Limited, Hong Kong. With more than 30 years of experience in the semiconductor industry, he
has been positioned in different senior engineering roles in package and process development as well as in
manufacturing operations. He holds more than 40 US patents in semiconductor packaging technologies.
Email: chfan@asmpt.com

Eric NG is the Business Development Manager for Advanced Packaging Technology (APT) at ASMPT
Limited, Hong Kong. With over 20 years of experience in the semiconductor industry, he has held various roles in product and
process development, research and development, sales, and business development. He has worked in different fields such as IC
packaging, FPC manufacturing, phase-change temperature control devices, and HDD manufacturing.

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