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Figure 1: Enabling co-optimization with rapid cycles of learning to accelerate time to market. SOURCE: Multibeam Corporation
masks (Figure 1). Layout changes can meet the needs of specific applications. optimizing performance and power
be quickly implemented using MEBL’s Dense interconnects between chiplets efficiency. Data shows that “purpose-
data prep computer, increasing the speed will eliminate the need for large SERDES built silicon,” optimized to accelerate
of learning cycles, and reducing time-to- circuits previously needed for high- specific tasks, performs significantly better
market for new products. bandwidth chip-to-chip communication. than general-purpose CPUs. This means
The MEBL solution addresses this need. advanced applications requiring high
Industry trends driving a new Mass customization. Customized computation, such as 5G, intelligent edge
generation of e-beam lithography devices’ compute throughput is distinctly devices, smart cars, and AI, will all benefit
Aside from the need for greater fab higher than that of general-purpose from the trend toward mass customization
productivity in EBL technology, there are devices. This has led to an industry- and purpose-built silicon. With purpose-
two major semiconductor industry trends wide shift toward mass customization—a built silicon and mass customization on the
that need to be addressed as discussed below. trend that aligns very well with advanced rise, the demand for advanced packaging is
Purpose-built devices. Tightly integrated packaging. Advanced packaging allows soaring (Figure 2).
processing, memory, communications, designers to develop purpose-built Extendible very large-scale interposers
and other functions, can be optimized to devices from individual chiplets, thereby will allow manufacturers to maximize
Figure 2: Optimizing performance and power efficiency of advanced packaging by facilitating high-throughput purpose-built silicon and shifting to mass customized
designs. SOURCES: Multibeam Corporation, SkyWater Technology
8 8 Chip Scale Review July • August • 2023 [ChipScaleReview.com]
