Page 11 - Chip Scale Review_July August_2023-digital

Figure 3: The evolution of advanced packaging to next-generation advanced packaging. SOURCE: Multibeam Corporation
p e r fo r m a n c e b y e n a bl i ng m o r e edge computing converge to drive growth https://www.spiedigitallibrary.
connections between larger numbers of in the semiconductor industry, a next- org /con ference -proceed i ngs-
chiplets in compact, low-power packages. generation direct-write lithography system of-spie/12497/1249705/ Hig h-
As packaging evolves and these industry will eliminate in-package bottlenecks and p r o d u c t iv i t y - d i r e c t - w r i t e -
shifts accelerate, back-end lithography enable larger-scale integration of compact, e - b e a m -l it h og r a p hy - - a n -
will evolve as well. Mask-based optical low-power/high-functionality chiplets. enabling/10.1117/12.2658237.short
lithography is a natural fit for high- In addition to enabling greater latitude to 5. K. Felton, “Slipping IC package
volume manufacturing and has played an innovate, the new generation of direct- design schedules and what to
integral role in the chip industry’s success. write EBL gives developers of new devices do about it,” Chip Scale Review,
However, device costs rise when fabricating a faster, cost-effective route to market. p. 37, May/June 2023 https://
small batches of customized wafers with chipscalereview.com/wp-content/
mask-based lithography technology. References uploads/flipbook/33/book.html
Further, mask-based lithography is 1. M. Chen, J. Shen, “TSMC opens
hindered by die shift that can significantly new a dva nced backend fab,” Biographies
reduce yield. Such limitations make mask- Digitimes Asia, June 2023 https:// David K. Lam is founder, chairman
based lithography less practical for the w w w. d i g i t i me s . c om / ne ws / & CEO of Multibeam Corporation in
next-generation of advanced packaging a20230608PD214/tsmc-3dfabric- Santa Clara, CA, where he leads the
applications. In contrast, maskless e-beam advanced-packaging-testing.html development of Multicolumn Electron-
direct writing has inherent advantages in 2. D. Patel, “Advanced packaging part Beam Lithography (MEBL) systems
writing fine resolutions across large areas, 1 – pad limited designs, breakdown for semiconductor manufacturing.
tying together disparate chiplets into high- of economic semiconductor scaling, He is the founder and former CEO of
performing integrated packages. The het e rogeneou s comput e, a nd Lam Research. Lam earned his PhD in
maskless MEBL system makes it possible chiplets,” Dec. 2021 https://www. Chemical Engineering from M.I.T. Email:
to adjust for die shift, enabling denser semianalysis.com/p/advanced- dlam@MultibeamCorp.com
interconnects between varied chiplets. packaging-part-1-pad-limited Ken MacWilliams is President and
This adaptability is crucial in integrating 3. C. Sandstrom, R. Davis, B. San Jose, board member of Multibeam Corporation,
heterogeneous chips into new purpose- “Large-panel fan-out perspective on Santa Clara, CA. He has helped develop
built devices (Figure 3). cost, yield, and capability,” Chip Scale and commercialize novel equipment
Review, p. 34, Nov/Dec 2022 https:// platforms and processes for the world’s
Summary chipscalereview.com/wp-content/ leading semiconductor manufacturers,
System and packaging development uploads/flipbook/30/book.html and held senior management positions
cycles can take years. With a high- 4. K. P. MacWilliams, A. C. Ceballos, at Applied Materials, Novellus Systems
product ivit y d i rect-w r ite M EBL T. A . P r e s c o p , D. K . L a m , (acquired by Lam Research), Veeco, and
system, the development cycle can be “High-productivity direct-write Yield Engineering Systems (YES). He
reduced significantly. Moreover, this e-beam lithography: an enabling holds PhD and MS Electrical Engineering
new generation of direct-write EBL is patterning technology to augment degrees from Stanford U.
well-suited to support the shift toward your lithography toolbox,” SPIE
purpose-built edge devices. As AI and Advanced Lithography, April 2023

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