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INDUSTRY EVENTS

Highlights of the 24th EPTC Conference

By Ranjan Rajoo [GlobalFoundries] Andrew Tay [National University of Singapore]

T he 24th IEEE Electronics Methodology and Statistical Knowledge for

Qualifications of Consumer and Automotive
Pa c k a g i ng Te c h n ol o g y
Conference (EPTC2022) is an
international event organized Electronic Components,” by Dr. Fen Chen,
Cruise LLC (a GM company); 2) “Photonic
by the IEEE Singapore RS/EPS/EDS Technologies for Communication, Sensing,
Chapter and co-sponsored by the IEEE and Displays,” by Dr. Torsten Wipiejewski,
Electronics Packaging Society (EPS). Since Huawei Technologies; 3) “Reliability of
its inauguration in 1997, EPTC has been Heterogeneous Integration (HI) Systems -
established as a highly reputable international Reliability Needs of HI Stakeholders,” by
electronics packaging conference and is Prof. SB Park, The State University of New
the EPS flagship conference in the Asia- York, Binghamton; 4) “Fan-Out Packaging
Pacific Region. It aims to cover the complete and Chiplet Heterogeneous Integration,” by
spectrum of electronics packaging technology. Dr. John H. Lau, Unimicron Technology;
Topics include modules, components, and 5) “Advanced Packaging for MEMS Figure 2: First keynote speaker, Dr. Ravi Mahajan,
Intel.
materials, equipment technology, assembly, and Sensors,” by Dr. Horst Theuss, Infineon
reliability, interconnect design, device Technologies. architectures. He gave specific examples
and systems packaging, heterogeneous Dr. Chandra Rao, General Chair of the showing how product implementations
integration, wafer-level packaging, flexible EPTC 2022, gave the welcome address, can take advantage of these technologies
electronics, light-emitting diodes (LED), thanking all conference delegates, sharing to provide an unprecedented level of
the internet of things (IoT), 5G, emerging the conference statistics and extended performance, and described the challenges
technologies, 2.5D/3D integration technology, appreciation to sponsors, exhibitors and and opportunities in developing robust
smart manufacturing, automation and conference partners for their support. In advanced packaging architectures.
artificial intelligence (AI). EPTC2022 her opening speech (Figure 1), Dr. Kitty Dr. Raj Pendse, Director of Si Packaging,
featured keynotes, a panel, a heterogeneous Pearsall, the IEEE EPS President, presented Meta Reality Lab, delivered the second
integration roadmap (HIR) workshop, an overview of the society’s mission and keynote entitled, “New Directions and
technical sessions, invited talks, professional activities, and expressed her appreciation to Challenges in the Packaging of augmented
development courses (PDCs), interactive the EPTC2022 organizing committee for its reality/virtual reality (AR/VR) Hardware
sessions, packaging education workshop, and great work. (Figure 3).” His presentation focused on the
an exhibition and networking activities.
This year, the 24th EPTC2022 went in-
person as opposed to being virtual the last
two years (2020 and 2021) due to COVID-19.
The conference was held from December
7 to December 9 at the Grand Copthorne
Waterfront Hotel in Singapore. With over
430 attendees from 20 countries, it was a
good opportunity to catch up with industry
technologists and academicians. The
conference had a total of 201 papers, with Figure 1: Dr. Kitty Pearsall, EPS President, giving Figure 3: Second keynote speaker, Dr. Raj Pendse,
137 oral and 36 interactive presentations; 28 her opening speech. Meta.
papers were pre-recorded for on-demand
viewing by those unable to travel due to Following the opening ceremony, three new trajectory for Si packaging technology
COVID-19 restrictions in their respective keynotes were delivered by prominent leaders set by the emergence of AR/VR hardware
countries. The conference had three keynotes, from industry. Dr. Ravi Mahajan, Intel Fellow, and advanced wearable computing. The next
a panel session, a HIR workshop, a packaging gave the first keynote on “Challenges and major step in that evolution will be wearable
education workshop, 6 invited presentations, Opportunities in Heterogeneous Integration computing in the form of novel, hands-off
two exhibitor presentations, 42 oral sessions, (Figure 2).” His speech addressed the and all-day wearable AR/VR devices like
and two interactive presentation sessions. tremendous opportunities that heterogeneous AR glasses. These devices will continue
The conference kicked off with 5 half- integration presents in different application the remarkable journey of miniaturization
day professional development courses: environments. He also focused on the and power/performance carved out by their
1) “Reliability Engineering Testing projected evolution of advanced packaging predecessors. Dr. Pendse also discussed the

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