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January • February 2023 CONTENTS
Volume 27, Number 1

DEPARTMENTS

INDUSTRY EVENTS
6 Highlights of the 24th EPTC Conference
By Ranjan Rajoo [GlobalFoundries]
Andrew Tay [National University of Singapore]

Recently, through-silicon via (TSV) technologies
have been widely used in high-bandwidth FEATURE ARTICLES
memory for high-performance computing or
high-density memory modules. For mobile Fan-out wafer-level package for memory applications
memory packaging, conventional wire 10
bonding is still being used, due in part to cost By Ho-Young Son, Ki-Jun Sung, Jong-Hoon Kim, Kangwook Lee
considerations. As overall mobile memory [SK hynix Inc.]
system performance is improved, however, there
is a need for a thinner package that has better
thermal and electrical performance. Inside this
latest issue of CSR, the Hynix Integrated Fan-
out Memory (HIFOM) is described—it’s a chip
stackable fan-out wafer-level package that
offers better performance than conventional
wire-bonded type memory packages.
Cover image courtesy of iStock/Sunshine Seeds

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