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Volume 27, Number 1
January • February 2023
The Future of Semiconductor Packaging
FEATURE ARTICLES [continued]
STAFF
Kim Newman
Publisher 21
knewman@chipscalereview.com Measuring bump height uniformity to improve yield
using 3D inspection
Lawrence Michaels By Tim Skunes
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Senior Technical Editor
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26 Ultra-thin mold cap for advanced packaging
By Nabankur Deb, Xavier Brun
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35 Oxide crack risk assessment during probing over
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