Page 41 - Chip Scale Review_January February_2023-digital

and other stress-related processes during
the manufacturing flow.

Acknowledgment
Portions of this article were presented
at SWTest 2022.
References
Table 1: Weibull parameters for all pad/tip diameter combinations.
1. O. Nagler, M. Reinl, F. Kaesen, I.
Eisele, “Advanced characterization
of semiconductor wafer probing
methodology,” Proc. of the 23rd
International Conf. on Electrical
Contacts, Sendai, 2006, pp. 97–102.
2. M. Unterreitmeier, Contact related
Failure Detection of Semiconductor
Layer Stacks using an Acoustic
E mi s sio n Te st Me th o d, FAU
Forschungen, Reihe B, Medizin,
Naturwissenschaft, Technik Band 33.
Erlangen: FAU University Press, 2020.
DOI: 10.25593/978-3-96147-306-9.
3. T. Krebs, Experimental Evaluation
and Statistical Analysis of the
Electrical Contact Resistance during
Wafer Test; Master Thesis. Aachen:
Universitätsbibliothek RWTH
Aachen, 2018.
4. C. Liu, et al., “Nanoindentation
characterization of thin film stack
structures by finite element analysis
and experiments using acoustic
Figure 9: Crack probability plot for pad stack option A vs. B and tip diameter 5µm vs. 10µm on the Weibull scale. emission testing,”Materials Science
in Semiconductor Processing, vol.
which helps to define the pad stack design The accuracy of the AE test method 147, p. 106737, 2022.
for a more reliable wafer test. was correlated by conventional failure 5. O. Nagler, S. Ber n rieder, M.
analysis methods. We have proven Unterreitmeier, “System and method for
Summary that a highly accurate, reliable, and examining semiconductor substrates,”
At Infineon Technologies, an advanced AE efficient detection of oxide cracks using U.S. Patent No. 10,859,534, 2020.
test method was developed and introduced the AE test method is possible even at 6. O. Nagler, M. Unterreitmeier, E. Liau,
that detects cracks in brittle semiconductor the nanometer scale dimension. This M. Ojeda, “An advanced method
layers during contacting by pointed tip POAA qualification method is used as for pad stack crack assessment
indenters. The process is similar to wafer a standardized qualification process at during probe-over-active-area,” Oral
probing and can be used to characterize the Infineon Technologies and is applied presentation at the 2022 Semiconductor
mechanical robustness of multi-layer stacks to characterize the robustness of Wafer Test (SWTest) Conf., Carlsbad
with a POAA design concept. semiconductor BEOL stacks for probing (CA), 2022.

Biographies
Dr.-Ing. Oliver Nagler is a Lead Principal for wafer test at Infineon Technologies in Munich, Germany with
more than 20 years experience and is the team lead of the pre-development group. He is the Manager of the
company’s probing lab and supports Infineon’s business units and wafer technology development regarding
probing qualifications. He holds several patents and international publications in probing technology, including
acoustic emission test method.
Dr.-Ing. Marianne Unterreitmeier is a technology expert for acoustic emission testing, holding several
patents, in the Test Technology and Innovation department at Infineon Technology in Munich, Germany. She has a Master’s
degree in micro- and nanotechnology and completed her PhD with honors at the FAU Erlangen-Nuremberg in 2019. She
achieved the Best Paper Award at the ESREF 2018 conference in Aalborg and the Regensburger Award for Women in Science
and Art in 2021.

39
Chip Scale Review January • February • 2023 [ChipScaleReview.com] 39