Page 19 - Chip Scale Review_November December_2022-digital
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Figure 7: Electrical correlation of test fixture by 110GHz PNA .
























        Figure 8: Thermal performance verification of HEATCon Ultra.
        Summary                            Customers have used this double-sided   Reference
          A double-sided probing system for   probing system to test actual devices   1.  V. Martin, M. Pars, E. Mounier,
        150µm-pitch CPO comprehensively    and the devices passed both room-      “Co-packaged optics,’’ https://www.
        integrates multiple fields, including   temperature and high-temperature   yolegroup.com/product/report/co-
        automation for high-precision optical   requirements.  These  results  also   packaged-optics-2022---focus-data-
        alignment, a 112Gbps design for a   support the feasibility of this test   centers/#
        fine-pitch probe head, and a high-  solution for the most advanced 2.5D
        performance stacked thermal chuck   and 3D packaged devices.
        with a double-sided probe head.



                       Biography
                         Collins Sun is a R&D director at WinWay Technology, Taiwan. He has responsibilities in various technical
                       fields, such as material science, high-speed product development, and thermal solutions. He received a PhD in
                       Physics from National Sun Yat-Sen U., Taiwan. Email: collins.sun@winwayglobal.com






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