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Benefits of TSVs for products They enable the mixing of exotic 2022.
Concerning D2W hybrid bonding, it material and/or different technologies 6. A. Jouve, et al., “Die-to-wafer direct
is important to mention the role of TSVs in one place for performance, design hybrid bonding demonstration with
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hybrid bonded types of interconnections range of direct bonding processes yields,” 3DIC, 2019.
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targeted products, several types of vias extremely attractive for increasing high- strategies compatible with D2W direct
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of imaging devices [10], high-density TSVs assets of hybrid bonding by adding design Comp. and Tech. Conf. (ECTC), 2021,
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of products with unprecedented dense References p. 1-2.
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key enablers for 3D microelectronics. adhesion mechanisms for wafer

Biographies
Emilie Bourjot is a Project Manager at CEA-Leti, Grenoble, France. Her current activities involve
developing advanced hybrid bonding schemes for 3D integration. Prior to joining CEA-Leti, she worked with
GlobalFoundries (Germany, USA) and within the IBM Alliance (USA) on the development of advanced FDSOI
technologies and sub-3nm nodes. She earned a MSc in Materials Physics from INSA Lyon (France) and a PhD
from Aix-Marseille U., France. Email emilie.bourjot@cea.fr

Frank Fournel is head of wafer bonding engineering at CEA-Leti, Grenoble, France, and a board member
of the international ECS Wafer Bonding Symposium Conference, the International WaferBond Conference, and the Low
Temperature Bonding 3D Conference. He has a Master’s in Materials Science from Ecole Supérieure de Physique et de Chimie
Industrielle de la ville de Paris (ESPCI) in Materials Science, and a PhD from Grenoble U.

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