Page 12 - Chip Scale Review_Jul Aug_2022-digital

Summary
Thermal management for wafer
test is changing dynamically because
of increased parallelism, high-power
densities, and complex IC designs. To
ensure that a device is tested at the
desired temperature, wafer chucks with
multiple temperature sensors, as well as
liquid-cooled capabilities, are required
for timely high-power dissipation. In
addition, smart thermal management
solutions are crucial for avoiding burnt
probes and damaged devices, to ensure
high test cell uptime. Various customer
production case studies have shown
the necessities of using a low thermal
resistance wafer chuck systems with
multiple temperature sensors, including
full-wafer contact memory testing with
up to 2000W, medium-contact areas with
up to 400W, and small-contact areas
of a few DUTs with up to 160W. With
leading-edge SoCs, high-bandwidth
memory testing, and heterogeneous
Figure 5: Automotive microcontroller test (400W) with 0°C test temperature. integrated devices, new thermal testing
challenges continue to arise. Our wafer
chuck approach is prepared to help
overcome future challenges with active
thermal control solutions.
Biographies
Mark us Kindler is a Managing
Director at ATT-Systems, a FormFactor
company, Munich Germany. Mr. Kindler
is responsible for global sales, marketing,
and applications. Prior to ATT-Systems,
he held various technical and business
leadership roles at Siemens, Hitachi, and
KLA. Email: Kindler@att-systems.com
Amy Leong is Senior Vice President,
C M O a n d G e n e r a l M a n a g e r a t
FormFactor Inc., San Jose, California.
Ms. Leong has held various management
positions at the company including
product marketing, product development,
business development, and mergers
and acquisitions. Prior to FormFactor,
Figure 6: 5G device test (160), with 0°C test temperature.
Ms. Leong worked in a variety of
temperature range for each test. power applications, 21 sensors are semiconductor engineering and business
The last customer study used a small ideal to reliably detect temperature roles at Gartner, KLA-Tencor and IBM.
20 x 21mm contact area, which is changes at all touchdown areas. In this
representative of applications such as customer study with a 5G device, 160W
5G and GPU devices. These examples was applied at 0°C and 105°C. As
with low parallelism and small contact demonstrated in Figure 6, the system
areas can have high-power densities dissipated the 160W within +/-2°C of
up to 125W/cm . For these high- the desired temperature.
2

10 Chip Scale Review July • August • 2022 [ChipScaleReview.com]
10