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for the next generation of heterogeneous
integration packages and future imaging
and process studies.
Ball Placement & Laser Soldering
Acknowledgements
The author would like to thank Timothy
Chang, Casey Donaher, Perry Banks and
Aries Peng for their assistance with this
article. In addition, he would like to thank
John Kennedy, Zhiyang Li, Karie Li and
Andrew To for their work on the software
algorithm, and Tom Swarbrick, Corey Shay,
Ryan Tsai and Hans Lin for their support
with the lithography work. The author
would also like to thank all of his teammates
3D Soldering BGA Soldering on the X500 project for their support.
References
1. J. Chang, K. Best, J. Lu, B. Ali, M.
Marshall, “Adaptive shot technology
to address severe lithography
challenges for advanced FOPLP,”
pp.: 918-923, ECTC, 2020.
2. K. Best, J. Chang, M. Marshall, J.
Lu, “FOPLP lithography solutions
to overcome die placement error,
predict yield, increase throughput
and reduce cost,” International
Presoldering of SMD Lid Sealing for Connectors Wafer-Level Packaging Conf.
Connector Elements & IR Sensors (IWLPC), 2019.
3. K. Best, M. Marshall, “Advanced
p a c k a g i ng m e t r o l o g y a n d
lithography that overcomes FOWLP/
FOPLP die placement er ror,”
IWLPC, 2018.
4. K. Ruhmer, “Lithography challenges
for 2.5D interposer manufacturing,”
pp.: 523-527, ECTC 2014.
5. R. McCleary, “Panel-Level advanced
packaging,” ECTC 2016.
Optoelectronics Device Assembly Through Hole Technology 6. K. Ruhmer, P. Cochet, R. McCleary,
Soldering “Panel-based fan-out packaging to
reduce costs,” SMTA/Chip Scale
Review IWLPC, Nov. 11-13, 2014.
7. K. Ruhmer, P. Cochet, R. McCleary,
N . C h e n , “ H i g h - r e s o l u t i o n
patterning technology to enable
www.pactech.de panel-based advanced packaging,”
sales@pactech.de pp.: 129-136, IMAPS 2014, Oct. 13-
16, 2014.
Biography
John Chang is a Sr. Applications Engineer at Onto Innovation, Hsinchu, Taiwan. He has a MS degree in
Nanoelectronics and Photonics from National Chung Hsing U., and he has more than 19 years of experience in
advanced packaging. Email: John.Chang@ontoinnovation.com.
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