Page 58 - ChipScale_Jan-Feb_2021-digital

ADVERTISER INDEX

Amkor Technology
www.amkor.com/test .............................. 1

Brewer Science
www.brewerscience.com ...................... 40
CyberOptics
www.cyberoptics.com ....................... OBC

DL Technology
www.dltechnology.com ........................ 42
E-tec Interconnect www.e-tec.com ...... 48
ECTC www.ectc.net ............................. 53

EV Group www.evgroup.com ............ 2
INTEKPLUS Co., Ltd.
www.intekplus.com ................................. 5
International Test Solutions
www.inttest.net ................................ 24

Ironwood Electronics
www.ironwoodelectronics.com ........... 38
ISC Co., Ltd. www.isc21.kr ............... 11

ITW EAE www.itweae.com ................ 15
JHI Co. Ltd. Taiwan
www.jhtek.com.tw .............................. 51
Johnstech International
www.johnstech.com ....................... IBC

LB Semicon www.lbsemicon.com ....... 37
Leeno Industrial
www.leeno.com ............................... 27, 31
Palomar Technologies
www.palomartechnologies.com ............ IFC

Plasma Etch www.plasmaetch.com .... 51
Figure 3: Experimental details of the process shown in Figure 2. Smiths Interconnect
www.smithsinterconnect.com ............. 6
industry are relatively expensive, require GaN µLEDs using laser-assisted
specialized equipment, and have been micro transfer printing,” 2019 IEEE Sonix www.sonix.com ......................... 46
demonstrated to attain yields of ~99.99%, 69th Elec. Comp. and Tech. Conf.
which falls short of the commercially viable (ECTC), Las Vegas, NV, USA. SÜSS MicroTec www.suss.com ...... 17
yields of six 9s. At the moment, we have 3. G . E z h i l a r a s u , e t a l. , “A
demonstrated the assembly of blue InGaN/ heterogeneously integrated, high- Universal Instruments
GaN microLEDs (50µm X 100µm) at resolution and flexible inorganic www.uic.com .................................... 19
>200PPI densities on our PDMS substrate µLED display using fan-out wafer- WinWay Technology
without metallization. In the near future, level packaging,” 2020 IEEE 70th www.winwayglobal.com ......................... 9
we plan to demonstrate a fully functional ECTC, Orlando, FL, USA.
passive matrix display on FlexTrate™ with 4. DISCO Technology Press Release, Yield Engineering Systems
heterogeneously integrated microLEDs Dec. 2015. https://www.disco.co.jp/eg/ www.yieldengineering.com .................... 33
and Si CMOS driver integrated circuits news/press/20151207.html
(ICs) with two levels of electroplated Cu
metallization at <40µm interconnect pitch. Biographies March April 2021
Goutham Ezhilarasu is a graduate student
References researcher at the Center for Heterogeneous Space Close March 5th
1. K. Ding, et al., “Micro-LEDs, a Integration and Performance Scaling, Materials Close March 10th
manufacturability perspective,” Department of Electrical Engineering, U. of
Applied Sciences 2019, 9, 1206. California, Los Angeles, CA USA. Email: For Advertising Inquiries
2. G. Ezhilarasu, et al., “High yield goutham93@ucla.edu ads@chipscalereview.com
precision transfer and assembly of

56
56 Chip Scale Review January • February • 2021 [ChipScaleReview.com]