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ADVERTISER INDEX
Amkor Technology
www.amkor.com/test ............................ IFC
Brewer Science
www.brewerscience.com ...................... 29
Chip Targets www.chiptargets.com ..... 51
CyberOptics
www.cyberoptics.com ....................... 15
DL Technology
www.dltechnology.com ........................ 46
E-tec Interconnect www.e-tec.com ...... 50
EV Group www.evgroup.com ............ 2
IBM
www.ibm.co/ai-hardware-center ........ OBC
International Test Solutions
www.inttest.net ................................ 1
Ironwood Electronics
www.ironwoodelectronics.com ........... 47
ISC Co., Ltd. www.isc21.kr ......... 37
Johnstech www.johnstech.com ......... IBC
LB Semicon
www.lbsemicon.com .............................. 7
MacDermid Alpha
www.MacDermidAlpha.com ............... 18
Micro Control Company
www.microcontrol.com ................... 44
Plasma Etch www.plasmaetch.com .... 30
Smiths Interconnect
www.smithsinterconnect.com ............. 35
Sonix www.sonix.com ......................... 24
SÜSS MicroTec www.suss.com ...... 27
Universal Instruments
www.uic.com .................................... 13
Figure 3: a) Methodology of fault localization; b) A short failure localized by sending a terahertz pulse along UTAC Group
interconnects of a 2.5D package; c) 3D X-ray image of shorted bumps; and d) 2D images of the failure extracted www.utacgroup.com ......................... 4
from 3D volume data showing the cross section from the different orientations.
WinWay Technology
Biographies Xueren Zhang is a Senior Staff www.winwayglobal.com ......................... 32
Sajay BG is a Scientist at the Institute of Engineer at Xilinx Asia Pacific, Singapore.
Microelectronics, A*STAR, Singapore. He He holds a PhD in Aeronautical and Yield Engineering Systems
holds a Master’s degree in Mechatronics Mechanical Engineering. His main focus www.yieldengineering.com .................... 21
and a PhD in Electrical & Electronic is on electronics packaging, assembly and
Engineering (Microelectronics). His work reliability. Prior to his current position,
is focused on semiconductor system in he worked at STMicroelectronics, January February 2021
a package and is currently involved in and at UTAC on package simulation Space Close January 5th
several publicly-funded research projects. and development. He has served as an Materials Close January 8th
Prior to this position, he was with the organizing committee member of EPTC,
semiconductor industry associated with and was the General Chair of EPTC 2017. For Advertising Inquiries
wafer-level packaging and MEMS. Email: ads@chipscalereview.com
nairs@ime.a-star.edu.sg
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52 Chip Scale Review November • December • 2020 [ChipScaleReview.com]
