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The Future of Semiconductor Packaging

STAFF Volume 24, Number 6
Kim Newman Publisher November • December 2020
knewman@chipscalereview.com
Lawrence Michaels Managing Director/Editor
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Debra Vogler Senior Technical Editor FEATURE ARTICLES (continued)
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LITHOSCALE ® CONTRIBUTING EDITORS 25 Chip-scale power transistor packaging
Steffen Kröhnert - Advanced Packaging
By Shaun Bowers
steffen.kroehnert@espat-consulting.com
[Amkor Technology, Inc.]
John L. Lau, Ph.D - Advanced Packaging
john_lau@unimicron.com
MLE™ Maskless Exposure Ephraim Suhir, Ph.D - Reliability
Lithography System suhire@aol.com 31 Testing AiP modules in high-volume
Rao R. Tummala, Ph.D - Advanced Packaging
rao.tummala@ece.gatech.edu production for 5G applications
By Jose Moreira
EDITORIAL ADVISORS [Advantest]
Andy Mackie, Ph.D (Chair) - Indium Corporation
Rolf Aschenbrenner, Dipl.-Phys. - Fraunhofer IZM
Arun Gowda, Ph.D - GE Global Research
John Lau, Ph.D - Unimicron 43 Functionalized materials enable yield
Leon Lin Tingyu, Ph.D - National Center for Advanced improvement in package test
Packaging (NCAP China)
By Jerry Broz, Bret Humphrey
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