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CONTENTS
November • December 2020 FEATURE ARTICLES
Volume 24, Number 6
5 The future of OSATS
By Favier Shoo, Santosh Kumar
[Yole Développement]
10 Enabling AI with heterogeneous integration
By Arvind Kumar, Mukta Farooq
[IBM Research]
AI makes very large demands on compute,
memory and bandwidth requirements. As
such, AI has provided a major incentive
for deployment of specialized components 19 Laser debonding in 2D and 3D
whereby heterogeneous integration has
risen to the forefront as a way to enable heterogeneous applications
high interconnectivity among them. By Koen Kennes
Additionally, heterogeneous integration [imec]
helps counter the diminishing returns Alice Guerrero
of scaling. [Brewer Science]
Photo courtesy of iStock/Andy
www.inttest.net
TEST CONTACTOR
CLEANING
CONTROLLED CONTACT RESISTANCE
through In-Situ Socket Cleaning
LOWERED COST OF TEST
through First Pass Yield Increase and Reduced Retest
Chip Scale Review November • December • 2020 [ChipScaleReview.com] 1 1
