Page 6 - ChipScale_May-June_2020-digital

When Moore’s Law no longer gets your

ICs where they need to go.

FormFactor takes on the challenge with test
and measurement solutions to reduce the
manufacturing cost of advanced packages.
Advanced packaging adds a new vertical dimension to IC layout. Multiple
dies merge into single systems with unprecedented interconnect density.
Performance goes up. Power consumption goes down.
And wafer-level test and measurement becomes nearly essential to
guarantee cost-effective fabrication and packaging. Successful verification
at this level requires probing and measuring with extraordinary precision,
optically, electrically and mechanically.
FormFactor not only understands the problem, it’s also providing timely
solutions to advance yield knowledge at every phase of wafer level test in
advanced IC packaging.
Let us help you rise to the occasion. Visit www.formfactor.com/go/ap.

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