Page 3 - ChipScale_May-June_2020-digital

CONTENTS

May • June 2020 DEPARTMENTS
Volume 24, Number 3
5 Technology Trends
A new era of smart packaging:
the introduction of chiplets
By E. Jan Vardaman
[TechSearch International, Inc.]

8 Market Update
The real third wave of semiconductor
market growth and some
packaging challenges
The requirements for back-end lithography By Asif Chowdhury
continue to grow as heterogeneous [UTAC Group]
integration becomes an increasing driving
force in semiconductor development and
innovation. The increased importance
of design flexibility, minimizing pattern FEATURE ARTICLES
distortion and die shifts in advanced
packaging, reducing consumable costs, 15 Maskless lithography addresses shift
supporting both thick and thin resists,
and shortening development cycles to 3D integration
between R&D and production, are just a By Bozena Matuskova and Thomas Uhrmann
few factors driving the need for maskless [EV Group]
exposure (MLE) technology.

Photo courtesy of EV Group

Amkor helps customers deliver

high performance network systems

Networking infrastructure is more critical today than
ever before. Amkor offers packaging solutions with the
high-power density, low-power consumption and
reduced size to satisfy the latest design requirements.

As a stable, long-term OSAT, Amkor partners with
networking customers to enable IC technologies by
delivering processors, controllers, power management
devices and memory and sensors products.

We provide technology expertise, intelligent package
design, quality systems and highly capable manufacturing
to meet the needs of networking customers.

Enabling the Future
www.amkor.com ▶ sales@amkor.com

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