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The Future of Semiconductor Packaging

STAFF Volume 24, Number 3
Kim Newman Publisher May • June 2020
knewman@chipscalereview.com
Lawrence Michaels Managing Director/Editor
lmichaels@chipscalereview.com FEATURE ARTICLES
Debra Vogler Senior Technical Editor
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20 Testing AiP modules in high-volume
CONTRIBUTING EDITORS production for 5G applications
ACCELERATING Steffen Kröhnert - Advanced Packaging By Jose Moreira
steffen.kroehnert@espat-consulting.com
[Advantest]
John L. Lau, Ph.D - Advanced Packaging
HETEROGENEOUS john_lau@unimicron.com 26 Embedded trace and 2-in-1 RDL for fan-out
Ephraim Suhir, Ph.D - Reliability
suhire@aol.com
panel-level packaging
INTEGRATION Rao R. Tummala, Ph.D - Advanced Packaging By Kesheng Feng and Kwangsuk Kim
rao.tummala@ece.gatech.edu
[MacDermid Alpha Electronics Solutions]
EDITORIAL ADVISORS
Andy Mackie, Ph.D (Chair) - Indium Corporation
Rolf Aschenbrenner, Dipl.-Phys. - Fraunhofer IZM 31 The true cost of undetected defects
Arun Gowda, Ph.D - GE Global Research
John Lau, Ph.D - Unimicron By David L. Adler and Brennan Peterson
Leon Lin Tingyu, Ph.D - National Center for Advanced [SVXR Inc.]
Packaging (NCAP China)

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