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Table 1: Actual and forecasted units of typical high-volume package types. SOURCE: 2016 through 2024F from Prismark; 2030F by Asif Chowdhury.
        the world, the proliferation of 5G mmWave   References                Biography
        Phase 2 will occur mostly in the second half   1.  2020 unit price estimation by Asif   Asif Chowd hur y is the SV P of
        of this decade. Because this is a fundamental   Chowdhury. The 2012 unit price from   Marketing & Cor porate  Business
        piece of technology for the convergence, the   the following source: https://docplayer.  Development and Head of Japan Sales
        double-digit semiconductor market growth   net/16415414-Internet-of-things-iot-  at UTAC Group, Singapore. He has
        will likely happen in the second half of this   and-its-impact-on-semiconductor-  over 25 years of experience in the
        decade as well. Cost-effective assembly and   packaging.html          semiconductor industry. Before joining
        test of 5G mmWave devices will be one of   2.  https://www.businessinsider.com/four-  UTAC, he held senior positions at
        the key challenges for success to ensure this   elements-driving-iot-2014-10?IR=T  Amkor Technology, Chandler, AZ, and
        third wave of semiconductor growth.  3.  https://www.statista.com/statistics/   Analog Devices, Wilmington, MA. He
                                               277931/automotive-electronics-cost-as-  holds a BS in Mechanical Engineering
        Acknowledgments                        a-share-of-total-car-cost-worldwide/  from U. of Texas at Arlington, an MS in
          The author would like to thank Carol   4.  h t t p s : / /w w w. s t at i s t a . c o m /  Mechanical Engineering from Southern
        Chiang from UTAC Singapore, Brandon    statistics/266813/growth-of-the-global-  Methodist U., and an MS in Finance
        Prior from Prismark, and Sandrine Leroy   vehicle-production-since-2009/  and an MBA from Northeastern U.
        from Yole Développment for their help   5.  h t t p s : / /w w w. s t at i s t a . c o m /  Email asif_chowdhury@utacgroup.com
        with providing some of the updated graphs   st at ist ics/262747/worldw ide -
        and tables.                            automobile-production-since-2000/
































        Figure 11: History and roadmap of RF front-end packaging. SOURCE: Yole Développment

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