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Table 1: Actual and forecasted units of typical high-volume package types. SOURCE: 2016 through 2024F from Prismark; 2030F by Asif Chowdhury.
the world, the proliferation of 5G mmWave References Biography
Phase 2 will occur mostly in the second half 1. 2020 unit price estimation by Asif Asif Chowd hur y is the SV P of
of this decade. Because this is a fundamental Chowdhury. The 2012 unit price from Marketing & Cor porate Business
piece of technology for the convergence, the the following source: https://docplayer. Development and Head of Japan Sales
double-digit semiconductor market growth net/16415414-Internet-of-things-iot- at UTAC Group, Singapore. He has
will likely happen in the second half of this and-its-impact-on-semiconductor- over 25 years of experience in the
decade as well. Cost-effective assembly and packaging.html semiconductor industry. Before joining
test of 5G mmWave devices will be one of 2. https://www.businessinsider.com/four- UTAC, he held senior positions at
the key challenges for success to ensure this elements-driving-iot-2014-10?IR=T Amkor Technology, Chandler, AZ, and
third wave of semiconductor growth. 3. https://www.statista.com/statistics/ Analog Devices, Wilmington, MA. He
277931/automotive-electronics-cost-as- holds a BS in Mechanical Engineering
Acknowledgments a-share-of-total-car-cost-worldwide/ from U. of Texas at Arlington, an MS in
The author would like to thank Carol 4. h t t p s : / /w w w. s t at i s t a . c o m / Mechanical Engineering from Southern
Chiang from UTAC Singapore, Brandon statistics/266813/growth-of-the-global- Methodist U., and an MS in Finance
Prior from Prismark, and Sandrine Leroy vehicle-production-since-2009/ and an MBA from Northeastern U.
from Yole Développment for their help 5. h t t p s : / /w w w. s t at i s t a . c o m / Email asif_chowdhury@utacgroup.com
with providing some of the updated graphs st at ist ics/262747/worldw ide -
and tables. automobile-production-since-2000/
Figure 11: History and roadmap of RF front-end packaging. SOURCE: Yole Développment
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