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CONTENTS
The Future of Semiconductor Packaging
STAFF
Kim Newman
Publisher
knewman@chipscalereview.com
Lawrence Michaels
Managing Director
Editor-in-Chief
lmichaels@chipscalereview.com
Debra Vogler
Senior Technical Editor
dvogler@chipscalereview.com
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Chip Scale Review
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Advertising Production Inquiries: 37 Heterogeneous packaging: Optimizing performance and
Lawrence Michaels power consumption
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By Jean-Charles Souriau [CEA-Leti]
Copyright © 2024 Haley Publishing Inc. Cu-Cu hybrid bonding for high-bandwidth memory (HBM)
Chip Scale Review is a registered trademark of Haley Publishing Inc. 43
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