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CONTENTS
Volume 28, Number 2
March • April 2024
High-precision wafer thinning using ultra-low-TTV glass 6
carrier and temporary bonding
Semiconductors are the foundation for artificial intelligence (AI), quantum computing, Internet of Things (IoT), and advanced wireless
communications, notably 5G. Due to Moore’s Law reaching its limit, and the system-on-chip (SoC) platform showing its shortcomings,
advanced packaging has become a critical area for development to enable continuous performance improvement at reasonable cost.
Glass-based advanced packaging and novel device architectures can play an important role. Jay Zhang [Corning Incorporated]
Photo courtesy of Corning Incorporated
FEATURE ARTICLES
14 3D integration of photonic and electronic chips
on a glass substrate
By Saif Wakeel, Peter O’Brien
[Tyndall National Institute, University College Cork, Ireland] 14
Luigi Ranno, Anuradha Agarwal, Lionel Kimerling
[Massachusetts Institute of Technology]
21 A package solution for an optical engine in silicon photonics
By David Ho, Steven Lin, YP. Wang
[Siliconware Precision Industries Co., Ltd]
21
28 Using an RDL-first FOWLP process to develop a large RDL
interposer package
By Soon Wee Ho, Siew Boon Soh, Boon Long Lau, Hsiao Hsiang-Yao,
Vempati Srinivasa Rao [Institute of Microelectronics, A*STAR (Agency for
Science, Technology and Research)]
28
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