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Volume 27, Number 6
November • December 2023
The Future of Semiconductor Packaging
FEATURE ARTICLES (continued)
STAFF
Kim Newman
Publisher 29 High-speed probe card architecture for high-end devices
knewman@chipscalereview.com By Xin-Reng Foo, Chee Hoe Lin [AMD Singapore]
Alberto Berizzi [TECHNOPROBE Italy]
Lawrence Michaels
Managing Director/Editor 38 Recent advances in bridges for chiplets communications
lmichaels@chipscalereview.com By John H. Lau [Unimicron Technology Corporation]
Debra Vogler
Senior Technical Editor
dvogler@chipscalereview.com DEPARTMENTS
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SUBSCRIPTION—INQUIRIES 47 IMAPS Symposium 2023
Chip Scale Review By Suresh Jayaraman [General Chair of IMAPS Symposium, 2023, and Amkor]
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