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November • December 2023
Volume 27, Number 6 CONTENTS
FEATURE ARTICLES
6 Die-to-wafer hybrid bonding development for HVM
By Jonathan Abdilla [BE Semiconductor Industries N. V.]
Guan Huei See [Applied Materials, Inc.]
14 Optimizing advanced IC substrates (AICS) for PLP
Legislation to support reduction in carbon dioxide By Keith Best [Onto Innovation]
emissions is driving the growth in the electric
vehicle (EV) market. LiDAR is also driving trends
in automotive photonics devices. This issue 19 Automotive gate driver package with galvanically-isolated
features two articles that cover these important communication linkage
needs. MRSI (a part of Mycronic Group) discusses
the photonics device assembly requirements By Ankur Shah, Burton Carpenter, Fred Brauchler, Di Liu, Pierre Calmes,
and trends in automotive LiDAR and presents JM Liu, Xueting Wu [NXP Semiconductors Inc.]
a solution for typical edge-emitting lasers and
VCSEL chips. To answer the need for on-board
systems such as EV traction inverters, DC/DC 25 Automotive LiDAR: Photonics assembly requirements
converters, etc., which must be connected to high- and trends
voltage power sources, NXP Semiconductors, Inc.,
presents a package designed for automotive high- By Limin Zhou, Avy Yi [MRSI, a part of Mycronic Group]
voltage gate driver applications.
Cover image courtesy of iStock/Just_Super
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