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• E C T C Yo u n g P r of e ss i o n als
Networking Panel
• Chaired by Yan Liu of Medtronic,
Inc., a networking panel focusing
on career development for young
professionals with the participation
of IEEE EPS Board of Governors
(Figure 3); and
• Heterogeneous Integration Roadmap
(HIR) Workshop
o Sponsored by the IEEE EPS and
chaired by William Chen of ASE,
Bill Bottoms of MTS, US, and Ravi
Mahajan of Intel, took place at our
conference with another packed
Figure 2: ECTC/ITHERM Diversity Panel. audience this year as well. Thank
you to the HIR committee for
bringing another excellent workshop
to ECTC.
This year the ECTC hosted a sold-out
lineup of 117 exhibitors in the Technology
Corner and attracted a record level of
industry support with 49 sponsorships and
13 media partners. This level of support
significantly indicates the growing interest
Figure 3: Great networking events—never too early to start attending ECTC!
in advanced packaging and the vital role
ECTC plays in this industry. This year’s
event delivered even more diversified
content. Besides the highly technical content
of this conference and several opportunities
to learn and get insights into the latest
developments and trends in microelectronics
packaging, ECTC is also well known for its
excellent networking events. ECTC 2023
offered over 10 receptions, gala, luncheons,
and networking events.
The feedback was overwhelmingly
Figure 4: We are looking forward to seeing you at the Gaylord Rockies Resort and Convention Center in positive, and on behalf of the entire
Denver, Colorado, USA for 2024 ECTC. Executive Committee, we would like to
thank all our participants and contributors for
• Co-chaired by Thomas Gregorich • ECTC CHIPS Act Special Session their strong and continued support. Special
(Infinera) and Chaoqi Zhang • Co-chaired by Nancy Stoffel of thanks go to the Executive Committee and
(Qualcomm), and moderated by GE Research, Jan Vardaman of IEEE EPS sponsoring organization for their
Jan Vardaman of TechSearch TechSearch International, and commitment and support in making this year
International on “Copper Hybrid William Chen of ASE on “Advanced a fantastic event.
Bond Interconnections for Chip- Packaging Manufacturing in North Looking forward, the 74th ECTC will
On-Wafer Applications;” America: Building the Ecosystem;” be held at the Gaylord Rockies Resort and
• ECTC Photonics Technical Sub- • ECTC/ITHERM Diversity Panel Convention Center in Denver (Figure 4),
Committee Special Session • Co-chaired by Kim Yess of Brewer Colorado, between May 28 and 31, 2024.
• Co-chaired by Stéphane Bernabé Science, Nancy Stoffel of GE The Call for Papers can be found at www.
of C E A L e t i , Fr a n c e , a n d Research, and Cristina Amon of ectc.net. Abstract submission will close on
Hiren Thacker of Cisco that University of Toronto, Canada, October 9, 2023. Plan to attend in-person
covered “Photonic Integrated on “Diversifying our Technical sessions, get to know new people, learn
Circuit Packaging: Challenges, Workforce to meet National Needs where this industry is going, and network
Pathfinding and Technology including the CHIPS Act Initiative” with your colleagues!
Adoption;” (Figure 2);
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Chip Scale Review July • August • 2023 [ChipScaleReview.com] 47
