Page 45 - Chip Scale Review_July August_2023-digital

of any next-generation technology In addition to the above approach like what companies do in developing
requires researchers, developers, that is different from other universities, their next-generation technologies. As
manufacturing supply-chain companies we focus on next-generation system can be seen in Figure 4, the industry
for materials, and tools (both hardware t e c h n o l o g i e s f r o m d e s i g n a n d consortium comprises researchers,
and software), manufacturers and architectures to materials and processes developers, supply chain companies,
users. So we developed an industry for substrates, design for reliability, manufacturers, and users from the U.S.,
consortium that spanned all of these design and development of thermal Europe, Japan, Korea and Taiwan.
areas globally—companies from the technologies, assembly, reliability,
U.S., Europe, Japan, Korea and Taiwan metrology, and all others required to Results using the model
are involved. make a system. This is very much Since its inception, there have
been many pioneering advances in
designs and architectures, materials,
processes, components and their
integration into system prototypes
at GT PRC. The best example that
verifies the success of our model is the
development of glass packaging from
concept in 2009, to commercialization
in 2023. Four global companies
announced their plans to manufacture.
They are Absolics in the U.S., DNP
in Japan, Unimicron in Taiwan, and
Intel, most recently.
Figure 5 shows how GT and its
industry partners invested $100M
and developed all the building block
technologies over a 10-year period.
The investments encompassed design
a nd a r c h i t e c t u r e s , t h r o u g h -v i a
technologies, thin-film redistribution
layers (RDL), integrated circuit (IC)
and board assembly, and many others.
Figure 5: Georgia Tech and its partners invested $100M in glass packaging R&D to commercialization.
Figure 6 summarizes the impact of
the Georgia Tech model in research,
education, i nf rast r uct u re, f u nds
raised, and in the industry consortium.

Acknowledgments
I wish to than k all my facult y
colleagues, all GT PRC students, and
global industry partners who contributed
to the creation and success of the Georgia
Packaging Research Center and its model.

Biography
Rao R. Tummala is the founding
Director and Distinguished Emeritus
Professor at the Georgia Institute
of Technology, Atlanta, GA. Prior
to that, he was an IBM Fellow and
Director of the Advanced Packaging
Technology Lab at IBM. He received
his PhD in Materials Science and
Engineering at the U. of Illinois.
Email rtummala@ece.gatech.edu
Figure 6: Impact of GT PRC in 25 years.

43
Chip Scale Review July • August • 2023 [ChipScaleReview.com] 43