Page 50 - Chip Scale Review_July August_2023-digital

We welcome previously unpublished,
non-commercial abstracts in areas including, but not limited to:
Applied Reliability
Assembly and Manufacturing Technology
Emerging Technologies
CALL FOR PAPERS OPENS AUGUST 15! RF, High-Speed Components & Systems
Interconnections
As the premier event in the semiconductor packaging Materials & Processing
industry, ECTC addresses new developments, trends Thermal/Mechanical Simulation & Characterization
and applications for fan-out & fan-in packages, 3D & Packaging Technologies
2.5D integration, TSV, WLP, flip-chip, photonics, LEDs, Photonics
materials and other integrated systems packaging topics. Interactive Presentations
Abstract submissions for the 74th ECTC are due by
October 9, 2023.
May 28 - May 31, 2024

Gaylord Rockies Resort & Convention Center
Denver, Colorado, USA

To submit, visit:
www.ectc.net

Conference Sponsors: Official Media Sponsor:

ADVERTISER INDEX

Adeia ........................................................................................ 25
Amkor Technology ................................................................. 1, 14
ASMPT ..................................................................................... 18
Brewer Science .................................................................. 44
Deca Technology ................................................................ 6
DL Technology ..................................................................... 27
E-tec Interconnect ............................................................. 37
ECTC ................................................................................. 48
EV Group ..................................................................................... 2
IMAPS ............................................................................... 45
INTEKPLUS CO., LTD. ......................................................... 22
Ironwood Electronics ........................................................ 36
ISC CO., LTD. ....................................................................... 32
JC Cherr y ............................................................................ 40
Leeno Industrial ....................................................... IFC, 44
MB Automation GmbH & Co. KG ........................................... 3
MRSI ..................................................................................... 17
Plasma Etch ........................................................................... 48
SEMI .................................................................................... IBC
Smiths Interconnect ........................................................... 21
Sonix ................................................................................... 41
SPEA .................................................................................... 11
SPIL ............................................................................... OBC
SÜSS MicroTec ......................................................................... 39
Technic ................................................................................... 3
Test Tooling Solutions Group ............................................... 30
TFE Co. Ltd ....................................................................... 29
TSE Co. Ltd ........................................................................ 4,5
WinWay Technology ............................................................... 12
September October 2023
th
Space Close September 5 • Ad Materials Close September 8 th
For Advertising Inquiries: ads@chipscalereview.com

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