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INDUSTRY NEWS

CHIPS Act, Si-photonics among topics

featured at 2023 IEEE 73rd ECTC

By Ibrahim Guven [General Chair, 2023 IEEE 73rd Electronic Components and Technology
Conference and Virginia Commonwealth University]
E C T C i s t h e p r e m i e r

international microelectronic
packaging, components,
and systems technology
conference. The 73rd edition of the ECTC
was held at JW Marriott Grande Lakes
in Orlando, Florida, USA, from May 30
to June 2, 2023, and it was a resounding
success. We had 1,619 attendees from 28
countries, the second-highest attendance
in the 73 years of ECTC.
Preparation for ECTC 2023 started Figure 1: Prof. Michael Manfra, Purdue University, delivering Keynote Speech and subsequent Q&A.
one year ago and was strongly supported
by over 250 experts from 15 countries— approved professional development • IEEE EPS President’s Panel
members of 10 technical committees. courses (PDCs). • C o - c h a i r e d b y I E E E E P S
The technical committees critically We were honored to have Michael President Kitty Pearsall of Boss
reviewed 618 submitted abstracts from M a n f r a , B i l l a n d D e e O’ B r i e n Precision, US and David McCann
industry (56.1%) and academia (43.9%), Distinguished Professor of Physics of Lyte, and moderated by Amr
resulting in 369 technical papers. and Astronomy at Purdue University, Helmy of University of Toronto on
The papers, organized in 41 sessions, and Scientific Director of Microsoft “How can Photonics Enable the
included five interactive presentation Quant um Lab West Lafayette, as Bandwidth Densities with Lower
sessions – one of which was dedicated our Keynote Speaker. Prof. Manfra Energy per Bit in Emerging SIP;”
to students – were presented by speakers (Figure 1) described the current state • ECTC Plenary Session
from 22 countries. of quantum computing from a hardware • Co-chaired by Kevin Gu of
The most attended topics reflected perspective, listing the challenges Metawave Corp. and Ivan Ndip
interests in wafer/panel-level and and opportunities ranging from the of Fraunhofer IZM/Brandenburg
advanced substrate technologies, large basic choice of qubit platform, through University of Technology on
form factor dense system integration scalable control and readout, to system “Dig it al Tr a n sfor mat ion –
by fan out, and advancements in architecture. He focused on what The Cor nerstone of Fut u re
copper/silicon-oxide hybrid chip-to- the packaging community can now Semiconductor and Advanced
wafer bonding. The three CHIPS Act innovate to make this revolutionary Packaging Growth;”
special sessions also attracted many technology a reality. Following the • IEEE EPS Seminar
of our attendees. Special emphasis keynote speech, a substantial Q&A • Co-chaired by Takashi Hisada
was also given to Si-photonics with session was held. Prof. Manfra’s talk of IBM and Yasumitsu Orii of
two regular sessions and one special was captivating, inspirational, and Rapidus, Japan, on “The Future
session. There were six talks with more intellectually stimulating. of High-density Substrates –
than 400 attendees, ten with more than This year the conference included nine Towards Submicron Technology;”
300 attendees, and fifteen with more special sessions and panel discussions • ECTC Materials & Processing and
than 200. The most attended session that were very well attended and with Thermal/Mechanical Simulation
averaged a whopping 417 attendees international participation of experts & Characterization Technical Sub-
across seven talks. These attendance and executives across the supply chain. Committees Special Session
numbers unmistakably communicate the These events (see list below) featured • Co-chaired by Tanja Braun of
importance of ECTC in the packaging deep-dive discussions on technology Fraunhofer IZM, Germany, and
industry and the criticality of packaging developments, emerging applications, Przemyslaw Gromala of Bosch,
in the overall electronics industry. different perspectives, business and Germany on “Advanced Packaging
Supplementing the technical program industry insights, and trends, as well and HIR for Harsh Environment –
and co-located with the IEEE ITherm as career, diversity and workforce Current Status and Opportunities;”
Conference, ECTC offered 13 CEU- development topics: • ECTC Interconnections Technical
Sub-Committee Special Session

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