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Volume 27, Number 2
March • April 2023
The Future of Semiconductor Packaging
FEATURE ARTICLES [continued]
STAFF
Kim Newman 33 Electrical design challenges of multi-layered FO RDL MCM
Publisher
knewman@chipscalereview.com packaging
By Teny Shih, Sam Lin, Andrew Kang, Yu-Po Wang
Lawrence Michaels [Siliconware Precision Industries Co., Ltd.]
Managing Director/Editor
lmichaels@chipscalereview.com
41 Wafer-scale integration for graphene-based optoelectronics,
Debra Vogler sensors, and imaging devices
Senior Technical Editor By Souvik Ghosh [imec vzw]
dvogler@chipscalereview.com Amaia Zurutuza [Graphenea]
Alice Guerrero [Brewer Science]
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44 Emergence of India in semiconductors and packaging R&D,
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Lawrence Michaels and manufacturing
lmichaels@chipscalereview.com By Rao R. Tummala [Georgia Tech, USA]
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