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March • April 2023 CONTENTS
Volume 27, Number 2
FEATURE ARTICLES
7 3D chiplet integration with hybrid bonding
By Laura Mirkarimi
[Adeia, Inc.]
13 Accelerating 3D and heterogeneous integration with
high-volume D2W hybrid bonding
By Thomas Uhrmann [EV Group] and
Nelson Fan [ASMPT]
In response to a decade of slowing of Moore’s
Law, the semiconductor industry has
embraced advanced packaging with 2.5D Heterogeneous integration and chiplets and dielets:
and 3D platforms to address market demand. 20
Advances in packaging are leading the way to why the hype?
innovate product roadmaps. At the center of By Subramanian S. Iyer [The UCLA Center for Heterogeneous
revolutionary products today is hybrid bonding, Integration and Performance Scaling (UCLA CHIPS),
which is expected to become more pervasive in Samueli School of Engineering, University of California, Los Angeles]
the chiplet era.
Cover image and feature article entitled 3D 28 Hybrid bonding bridge for chiplet design and
chiplet integration with hybrid bonding is heterogeneous integration packaging
contributed by Adeia By John H. Lau
[Unimicron Technology Corporation]
Chip Scale Review March • April • 2023 [ChipScaleReview.com] 1 1
