Page 5 - ChipScale_Mar-Apr_2020-digital

The Future of Semiconductor Packaging

STAFF
Kim Newman Publisher
knewman@chipscalereview.com Volume 24, Number 2
Lawrence Michaels Managing Director/Editor March • April 2020
lmichaels@chipscalereview.com
Debra Vogler Senior Technical Editor
dvogler@chipscalereview.com FEATURE ARTICLES
CONTRIBUTING EDITORS
ACCELERATING Steffen Kröhnert - Advanced Packaging 12 Antenna in package (AiP) technology for
steffen.kroehnert@espat-consulting.com
5G growth
John L. Lau, Ph.D - Advanced Packaging
HETEROGENEOUS john_lau@unimicron.com Curtis Zwenger
Ephraim Suhir, Ph.D - Reliability
[Amkor Technology, Inc.]
suhire@aol.com
INTEGRATION Rao R. Tummala, Ph.D - Advanced Packaging 17 Advanced FOWLP for small form factor and
rao.tummala@ece.gatech.edu
EDITORIAL ADVISORS high-performance microcontroller apps
Andy Mackie, Ph.D (Chair) - Indium Corporation Gaurav Sharma
Rolf Aschenbrenner, Dipl.-Phys. - Fraunhofer IZM [NXP Semiconductors]
Arun Gowda, Ph.D - GE Global Research
John Lau, Ph.D - Unimicron 23 Holistic approach to improve the
Leon Lin Tingyu, Ph.D - National Center for Advanced
Packaging (NCAP China) reliability of sub-5μm L/S Cu RDLs
Ralf Schmidt
SUBSCRIPTION—INQUIRIES [Atotech Group]
Chip Scale Review
All subscription changes, additions, deletions to any
and all subscriptions should be made by email only to 29 Die-to-wafer hybrid bonding for 2.5D and
subs@chipscalereview.com
3D integration
Laura Mirkarimi
Advertising Production Inquiries: [Xperi Corporation]
Lawrence Michaels
lmichaels@chipscalereview.com
36 Navigating dicing on increasing complex
shrinking die
EV Group establishes Heterogeneous Integration Competence Center™ to accelerate Copyright © 2020 Haley Publishing Inc. M. Todd Wyant
Chip Scale Review (ISSN 1526-1344) is a registered trademark of
new product development fueled by heterogeneous integration and advanced packaging Haley Publishing Inc. All rights reserved. [Texas Instruments]
Subscriptions in the U.S. are available without charge to qualified individuals
in the electronics industry. In the U.S. subscriptions by first class mail are
Open access innovation incubator for EVG customers and partners across the $125 per year. Subscriptions outside of the United States are $225 per year 41 Going beyond traditional scaling with SiP
to other countries.
microelectronics supply chain, guaranteeing the highest IP protection standards Chip Scale Review, (ISSN 1526-1344), is published six times a Yoko Fujita
[Zuken]
year with issues in January-February, March-April, May-June, July-
August, September-October and November-December. Periodical
postage paid at Los Angeles, Calif., and additional offices.
Combining EVG’s world-class wafer bonding, thin-wafer handling and lithography POSTMASTER: Send address changes to Chip Scale Review magazine
products and expertise, as well as pilot-line production facilities and services P.O. Box 2165, Morgan Hill, CA 95038 45 Laser assisted flip-chip bonding
Printed in the United States Nokibul Islam
[JCET]
Leveraging the state-of-the-art cleanroom facilities at EVG’s headquarters in Austria,
supported by EVG’s worldwide network of process technology teams

Official Publication Sponsor

Official Media Sponsor

GET IN TOUCH to discuss your manufacturing needs
HeterogeneousIntegration@EVGroup.com Co-Host & Organizer
Chip Scale Review March • April • 2020 [ChipScaleReview.com] 3 3