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CONTENTS
March • April 2020
Volume 24, Number 2
DEPARTMENTS
5 Post–Moore’s Law electronics: now,
until quantum electronics
Rao R. Tummala
[Georgia Tech]
9 Maskless lithography for MEMS and
advanced packaging
Implementing 5G technology requires Paul Lindner
transmission of large amounts of data, [EV Group]
reliable connections, quicker response
time, and better coverage. Fully-
integrated RF front-end modules using
a system in package (SiP) that includes 54 Industry News
antenna in package (AiP) technology,
double-sided assembly, advanced wafer-
level redistribution layer (RDL), passive
component integration, and sophisticated
RF shielding techniques provide the most
advanced 5G package.
Image courtesy of Amkor
Amkor has the capabilities and experience
to ensure automotive success.
Automotive customers require
suppliers that have the highest
levels of experience, technical
capability and quality.
As a stable, long-term OSAT, Amkor
partners with semiconductor customers
supplying automotive Tier 1s and OEMs.
We provide technology expertise, intelligent
package design, quality systems based on
automotive standards and highly capable
automotive-grade facilities.
Enabling the Future
www.amkor.com ▶ sales@amkor.com
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