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ACCELERATING
HETEROGENEOUS
INTEGRATION
EV Group establishes Heterogeneous Integration Competence Center™ to accelerate
new product development fueled by heterogeneous integration and advanced packaging
Open access innovation incubator for EVG customers and partners across the
microelectronics supply chain, guaranteeing the highest IP protection standards
Combining EVG’s world-class wafer bonding, thin-wafer handling and lithography
products and expertise, as well as pilot-line production facilities and services
Leveraging the state-of-the-art cleanroom facilities at EVG’s headquarters in Austria,
supported by EVG’s worldwide network of process technology teams
GET IN TOUCH to discuss your manufacturing needs
HeterogeneousIntegration@EVGroup.com
