Page 20 - Chip Scale Review Sep Oct_2022-digital

Bond force. Depending on the bonding a bond force ranging from 0.5N to 30N Substrate dimensions. Substrates
material property, bonding processes and is usually sufficient to cope with most of can be 12-inch wafers or glass carriers,
die sizes, the required bond force may vary the requirements. In the case of TCB, the 300mm x 300mm metal carriers, 50mm
across a large range. For fan-out applications, required bond force can be as high as 300N. x 50mm singulated substrates, or 600mm
x 600mm metal carriers. Die attach tools
are typically classified as wafer-level
(12-inch wafer or 300mm quad panel)
or panel-level (up to a 600mm x 600mm
panel); consequently, the maximum
substrate dimensions must be considered
while selecting a die attach tool.
Cleanliness. Class 100 is the most
common cleanliness requirement for a
die attach tool for AP. Certainly, demand
for a higher degree of cleanliness up
to Class 1 is now being required for
emerging applications, and the process
cost of ownership will be reflected in the
technology requirement.
Inl ine automat ion. Automatic
material load/unload by means of over-
hoist transport (OHT) or automatic
guided vehicle (AGV) is recommended,
e s p e c i a l l y w h e n p r e p a r i n g f o r
HVM. Semiconductor Equipment
Communication Standard (SECS) and the
Generic Model for Communications and
Control of Manufacturing Equipment
(GEM) are the basic standards that apply
to communications between the die
attach tool and equipment automation
(EAP) host.
Traceability. Traceability is one
of the most important manufacturing
control requirements in HVM especially
when the product is for automotive
applications. Basic information such as:
wafer, substrate, bonding parameters,
and inspection results of all production
activities, is allowed for access, storage
and uploading to the manufacturing host
computer database.
Figure 4: Die placement accuracy of 1μm. SOURCE: ASMPT internal report, 2019

Figure 5: Multi-die fan-out package. SOURCE: [2]

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