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TECHNOLOGY TRENDS
Semiconductor packaging trends:
an OSAT perspective
By David Clark [Amkor Technology, Inc.]
W h i l e s u p p l y c h a i n The market is underpinned by general the industry will stabilize in 2022,
issues, including severe
persist through 2023.
ou t s ou r c i ng , f u n c t io n a l i t y a n d
shor tages, occupied trends in increasing manufacturing however, substrate challenges will
much of the visibility for semiconductors semiconductor content. Notable growth
in 2021, semiconductor manufacturers and drivers come from multiple market Mobile packaging trends
their outsourced semiconductor assembly segments such as 5G connectivity, Many of the market growth drivers
and test suppliers (OSATS) have continued automotive, data center, artificial require increasing levels of system
to make technical progress in many areas. intelligence (AI) and networking. 5G integration to meet the ever-increasing
These technology improvements address forms the backbone of many connected demand on performance, power and
the advanced packaging requirements of devices and services. While 5G is cost. As the OSAT supplier becomes an
leading-edge applications in key market primarily a wireless connectivity increasingly integral part of the overall
segments. Before going into specifics, let’s growth opportunity, it also is an enabler system solution, it is in the advanced
look at the overall market outlook. for many adjacent markets generating packaging segment where continued
further semiconductor content growth. innovation in the areas of system in
Market outlook Despite industry-wide supply chain package (SiP), 2.5 and 3D packaging
The semiconductor packaging market constraints since 2020 and expected architectures are most apparent.
continues to show a prosperous outlook to continue into 2022, many OSATS Cellular connectivity continues
and is forecast to grow to $96B by were still able to generate record t o d r ive a dva nc e me nt s i n r a d io
2026 (3.8% compound annual growth revenues. Well reported shortages in frequency (RF) SiP technologies.
rate (CAGR) from 21-26) (Figure 1). IC foundry capacity, together with a With the rise of 5G, cellular frequency
This market is typically divided into constrained substrate supply chain, bands have increased considerably,
mainstream and advanced packaging made for a challenging 2021. With requiring innovative solutions for the
segments with the latter being expected newly publicized investments in these packaging of RF front-end modules
to exceed the mainstream segment for the areas for capacity expansion, it is hoped for smartphones and other 5G-enabled
first time by 2026. that lead times will slowly reduce, and devices. Amkor’s double-sided molded
Figure 1: Advanced packaging vs. traditional packaging market forecast (2014-2026). SOURCE: [1]
6 6 Chip Scale Review January • February • 2022 [ChipScaleReview.com]
