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where and what to partition, what is the Today, the chiplet era is in its infancy. The currently in the research phase are among
workload and what silicon nodes are way systems are designed to date has been the future package design possibilities.
optimal in terms of cost and yield for each based upon historic approaches to moving
function. With this added system design data. A more pioneering approach to the Summary
freedom, the OSATS’s role is increasingly movement of data to support a metaverse To satisfy the application needs in leading
important in the system-level design, future will redefine how next-generation markets and meet growth projections,
chip-chip I/O routing, power distribution, systems are configured. Concepts such several different advanced packaging
thermal optimization, and more. as co-packaged optics (CPOs) that are technologies are required. For continued
OSATS’, as well as semiconductor
manufacturers’ success, a few key criteria
must be satisfied. Semiconductor original
equipment manufacturers (OEMs) and
OSAT suppliers must continue to improve
their collaboration during the design
phase to make sure the right problems
are being solved early in the innovation
LEADERS IN process. To minimize footprints, effectively
manage power and continuously improve
MICRO DISPENSING performance, the technology investments
by OSATS must occur with financial
TECHNOLOGY stability as a goal. With the right packaging
concepts, success is demonstrated through
capability to scale up to satisfy volume
SMALL REPEATABLE VOLUMES requirements in these growing markets.
ARE A CHALLENGE, BUT NOT
IMPOSSIBLE IF YOU HAVE BEEN This is essential to avoid future supply
CREATING THEM AS LONG AS WE HAVE. chain issues.
Acknowledgments
SWIFT is a registered trademark of
TO DO IT WELL, Amkor Technology, Inc.
©
2022, Amkor Technology, Inc. All
WE PROVIDE THREE THINGS: rights reserved.

References
1. Yole Développement, Status of the
Dispensing Expertise in a variety of microelectronic Advanced Packaging Industry 2021,
packaging applications. p. 123.
2. Gartner/Semiconductor Forecast
Feasibility Testing & Process Verification based Database, Worldwide, 3Q21 Update
on years of product engineering, material flow testing – Published October 4, 2021.
and software control.
Biography
Product Development for patented valves, David Clark, Sr. Director, Amkor
dispensing cartridges, needles, and accessories. Technology, Inc. is responsible for
Product Marketing and strategic business
development in Europe. Prior to joining
Amkor, David held various business
development and engineering positions
at FlipChip International (FCI), Leica
Our Micro Dispensing product line is proven and trusted by Microsystems and Agilent Technologies.
manufacturers in semiconductor, electronics assembly, medical He has been granted 5 patents in
device and electro-mechanical assembly the world over. Optoelectronics and Device Packaging
www.dltechnology.com. and holds a BEng Honors Degree in
Electronic, Electrical and Optoelectronic
Engineering from the U. of Glasgow.
216 River Street, Haverhill, MA 01832 • P: 978.374.6451 • F: 978.372.4889 • info@dltechnology.com
Email: david.clark@amkor.com

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