Page 10 - Chip Scale Review_January February_2022-digital

Figure 2: A double-sided molded ball grid array (DSMBGA) package.
ball grid array (DSMBGA) is the for handheld and other small mmWave safety and comfort levels within ADAS-
leading example of such solutions devices, AiP/AoP provides improved signal enabled vehicles result in an expectation
(Figure 2). integrity with reduced signal attenuation for increased sensor deployment with the
With the arrival of 5G networking, there and addresses the range and propagation number of sensors increasing by 9.2%
has been a change in frequencies, adding challenges that occur at higher frequencies. CAGR from 2020 to 2025 [2]. By 2026,
frequency bands above 3GHz in FR1 and the majority of high and some mid-range
millimeter wave (mmWave) range in FR2. Automotive packaging trends vehicles will integrate camera and radar,
This growing number of new frequencies In the automotive area, advanced driver as well as light detection and ranging
combined with the variety of multiplexing assistance systems (ADAS), electrification, (LIDAR) sensors.
methods significantly increases the and concepts such as the virtual cockpit, Multiple sensing techniques are being
complexity of the RF front end. Integration offer significant new opportunities for deployed to cover a vast array of range,
using SiP allows customers to design, advanced packaging and innovation. These environmental and accuracy requirements.
tune and test RF subsystems allowing for areas of new innovation are contributing Integration is a key focus to reduce the
a reduction in design iterations and an to positive automotive semiconductor form factor and improve sensitivity levels.
accelerated time-to-market. Our double- growth whereby the market is projected to Sensor packaging platform development
sided packaging technology has vastly grow from $38.7 billion in 2020 to almost and re-use of mature assembly processes
increased the level of integration for RF US$82.6 billion in 2025 [2]. Implementing are key to controlling cost. For example, in
front-end modules used in smartphones and
other mobile devices.
For 5G smartphones and other mmWave
applications, antenna integration, either
through antenna in package (AiP) or
antenna on package (AoP) technologies,
simplifies the challenges associated with
designing products that operate at these high
frequencies. A variety of AiP/AoP design
methodologies provide the required form, fit
and function for these applications and can
include more than one antenna or antenna
array. Today’s AiP/AoP technologies can be
implemented through standard, as well as
custom, SiP modules to achieve a complete
RF front-end (RFFE) subsystem.
In addition to a reduced size required
Figure 3: Molded cavity and multi-sensor integration optical sensor packages.

8 8 Chip Scale Review January • February • 2022 [ChipScaleReview.com]