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January  •  February 2022          CONTENTS
        Volume 26, Number 1


                                              DEPARTMENTS
                                                    TECHNOLOGY TRENDS
                                                 6  Semiconductor packaging trends: an OSAT perspective
                                                    By David Clark
                                                    [Amkor Technology, Inc.]
                                                    TECHNOLOGY TRENDS
                                               11   Shrinking RADAR and LiDAR sensor packages – an
                                                    introduction to TINKER
         White-light scanning interferometry (WSI)   By Leo Schranzhofer [PROFACTOR], Martin Eibelhuber [EV Group],
         applied for 100% fine-pitch interconnect   Martina Chopart  [AMIRES]
         inspection during wafer-level packaging.
         The WSI system includes scanning
         interferometry for large FOV, high-
         speed, and multi-reflectance surface 3D     FEATURE ARTICLES
         measurement. Interference patterns can be
         detected to calculate RDL dielectric layer   3D interconnect inspection for heterogeneous chip
         thickness during panel/wafer-level 3D   16
         interconnect inspection.                    packaging using WSI
                                                     By Shahab Chitchian
         Cover image courtesy of INTEKPLUS           [INTEKPLUS CO., LTD.]
         CO.,LTD.
















































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