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Volume 25, Number 6
November • December 2021
The Future of Semiconductor Packaging
FEATURE ARTICLES (continued)
STAFF 26
Kim Newman Sustaining Moore’s Law with graphene
Publisher By Kunjesh Agashiwala, Junkai Jiang, Ankit Kumar,
Chao-Hui Yeh, Kaustav Banerjee
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DIE-TO-WAFER (D2W) Lawrence Michaels [University of California, Santa Barbara]
Managing Director/Editor
BONDING SOLUTIONS lmichaels@chipscalereview.com 37 Introducing hybrid graphene/metal structures in the BEOL
Debra Vogler
Senior Technical Editor technology roadmap
dvogler@chipscalereview.com By Swati Achra, Inge Asselberghs, Zsolt Tokei
[imec]

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