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November  •  December 2021         CONTENTS
        Volume 25, Number 6



                                              DEPARTMENTS
                                                    TECHNOLOGY TRENDS
                                                 7  Advanced wafer-level packaging offers a sustainable
                                                    path to high-performance computing
                                                    By Sally-Ann Henry, Jim Straus
                                                    [ACM Research]



         There are a plethora of devices and     FEATURE ARTICLES
         architectures that hold the promise of
         taking scaling beyond traditional Moore’s   10  Advanced microelectronics packaging technologies
         Law approaches. Research is being
         pursued in such technologies as qubits,    and their performance
         spintronics, ultra-low power quantum       By Ray Fillion
         devices, etc. But there is still much      [Fillion Consulting]
         to be done with advancing transistor
         technologies, as well as the evolution of   18  A new, higher density QFP
         back-end-of-line technology. The cover     By Chu-Chung (Stephen) Lee, Yao Jinzhong, Glenn G. Daves
         article describes how graphene is being    [NXP Semiconductors N.V.]
         used to establish a new BEOL platform.

         Cover image courtesy of Shutterstock















































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