Page 4 - Chip Scale Review_November December_2021-digital
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DIE-TO-WAFER (D2W)



           BONDING SOLUTIONS













                Fusion and hybrid bonding for next-generation
                heterogeneous integration


                Collective D2W bonding enabled by extensive
                knowledge in carrier preparation and die handling


                Direct placement D2W activation and cleaning
                complete solution with EVG®320 D2W



                Production-ready equipment solutions for
                successful integration of chiplets


                Heterogeneous Integration Competence Center™
                serving as leading-edge incubation center
                for customers and partners


















       GET IN TOUCH to discuss your manufacturing needs
       www.EVGroup.com                                                           EVG® 320 D2W
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